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【2024 RDSS&AO】Taiwan_Product Engineer

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Job updated 18 days ago

Job Description

  1. Leading-edge product development. Learn the most advanced technology semiconductor manufacturing, identify effective process solution for yield and chip performance improvement.
  2. Involve cross-team work for joining developed project. Coordinate with customer / Fab / different support team closely to address improvement opportunities and work-out solutions.
  3. Expand wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge by using comprehensive analysis skills to solve product issue.
  4. “More than Moore”. HV, Embedded-memory, RF, MEMS, and CIS products development, work with R&D / customer to develop new application in matured technology Si process.

Requirements

  1. Master's degree or above in Electrical Engineering, Physics, Material, and Photonics.
  2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design.
  3. Willing to learn new knowledge, good self-learning attitude, and enjoy challenges.
  4. Good communication skills, be able to work with cross-functional teams & customers.
  5. Fluent in English.
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No requirement for relevant working experience
40,000+ TWD / month
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Logo of TSMC 台積電.

About us

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.

TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.

TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

台積公司是全世界最大的專業積體電路製造服務公司。台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。

領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。

台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。


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