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The employer was active about 3 hours ago
負責藍牙與WiFi 2.4G 模組電路設計、電路板佈局及專案執行。 負責產品規格測試、除錯、試產及法規認證。 負責阻抗匹配、雜訊隔離與性能優化。 評估相關零件模組特性。 整合、測試無線通訊模組。
負責藍牙與WiFi 2.4G 模組電路設計、電路板佈局及專案執行。 負責產品規格測試、除錯、試產及法規認證。 負責阻抗匹配、雜訊隔離與性能優化。 評估相關零件模組特性。 整合、測試無線通訊模組。
235台灣新北市中和區
1.5M ~ 1.6M TWD / year
5 years of experience required
No management responsibility
[ 公司介紹 ] 無廠半導體公司，總部位於Sunnyvale, California 成立9年，已成功籌集三輪資金 與top foundry and tier-1 等客戶合作，提供解決方案給物聯網、移動設備、雲數據中心等 [職缺描述] • Engage in collaborative efforts with vendors and OSATs (such as Sigurd and Gi...
[ 公司介紹 ] 無廠半導體公司，總部位於Sunnyvale, California 成立9年，已成功籌集三輪資金 與top foundry and tier-1 等客戶合作，提供解決方案給物聯網、移動設備、雲數據中心等 [職缺描述] • Engage in collaborative efforts with vendors and OSATs (such as Sigurd and Gi...
300台灣新竹市東區
2M ~ 3M TWD / year
3 years of experience required
No management responsibility